RF SOI Compact (SPICE) Modeling Engineer
Job Description
The candidate should be able to apply his/her knowledge of semiconductor device physics in a practical compact model extraction scenario, such as being able to analyze and explain the trends in the data, being able to distinguish real trends from 'noise', associate various physical phenomena with the observed trends, submit electrical characterization requests, extract various compact modeling parameters, do various QA checks and submit the model for release.
The candidate should also be able to do design and layout of test structures; be able to correlate device cross section with layout; do various kinds of simulations in Cadence ADE; be proficient in writing python scripts for doing model parameter extraction, data analysis and QA; have knowledge of industry standard compact model families and parameter extraction tools/methodologies; have knowledge of Verilog-A and be able to write Verilog-A models; and be able to field customer queries pertaining the model.
Other Responsibilities:
Apart from strong technical skills, the candidate should also possess excellent communication skills and be able to work across geographies and time zones. He/She should be self driven and self motivated to excel, innovate and solve problems. This position is based out of Bangalore.
Required Qualifications:
- Education PhD in the domain of semiconductor devices
- Years of Experience 0 - 5