IB

Industry Consultant-Consulting Services

IBM
Mumbai11-16 LPA Posted 20 Nov 2025
FULL TIME
electronics packaging

Job Description

Key Responsibilities:

  • Act as an SME in electronics product engineering and development, focusing on semiconductor packaging and assembly processes.
  • Provide expertise in OSAT operations, including traditional and advanced assembly and test processes, terminology, data requirements, and implications on MES systems.
  • Drive B2B-SCM-MES integration for semiconductor manufacturing and assembly operations.
  • Support design validation and ensure alignment with foundry fabrication processes.
  • Work with Semiconductor MES Systems such as FactoryWorks, OpsCenter, Critical Manufacturing, or SiView to optimize manufacturing execution and data flow.
  • Collaborate with cross-functional teams to convey complex technical concepts to non-technical stakeholders.
  • Provide guidance on discrete manufacturing (PP) processes where applicable.

Required Education:

  • Bachelor's Degree in Electronics, Electrical Engineering, or a related field.

Required Technical and Professional Expertise:

  • 10+ years of experience in semiconductor/electronics product engineering and development.
  • Strong knowledge/experience in OSAT operations, including assembly/test processes, MES integration, and data management.
  • Hands-on experience in electronics product engineering and development from OSAT or EMS industries.
  • Experience with foundry fabrication processes.
  • Knowledge of any Semiconductor MES system (FactoryWorks, OpsCenter, Critical Manufacturing, SiView).

Preferred Technical and Professional Experience:

  • Practical, hands-on experience in electronics product engineering and development (OSAT/EMS industries).
  • Advanced knowledge of OSAT operations, MES integration, and data requirements.
  • Experience in design validation and foundry fabrication.
  • Discrete manufacturing (PP) expertise is a plus.

Required Skills

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